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  • Diamond wet pads, copper pads
  • Diamond wet pads, copper pads

    Features:

    • Premium copper bond matrix, high density diamond distribution

    • Designed for wet-only use, excellent cooling & low dust

    • Aggressive cutting power, outstanding scratch removal

    • Ultra-stable grinding performance, long service life

    • Smooth transition for fine grinding & pre-polishing

    Application:
    Ideal for concrete, terrazzo, marble and engineered stone wet grinding and polishing


    • ¥0.00
      ¥0.00
Product Description

Features:

  • Premium copper bond matrix, high density diamond distribution

  • Designed for wet-only use, excellent cooling & low dust

  • Aggressive cutting power, outstanding scratch removal

  • Ultra-stable grinding performance, long service life

  • Smooth transition for fine grinding & pre-polishing

Application:
Ideal for concrete, terrazzo, marble and engineered stone wet grinding and polishing



Item no.Diameterx Thickness
HWD30375x3mm
HWD304100x3mm
Grit size:  #30,#50,#100,#200,#400