


Features:
Premium copper bond matrix, high density diamond distribution
Designed for wet-only use, excellent cooling & low dust
Aggressive cutting power, outstanding scratch removal
Ultra-stable grinding performance, long service life
Smooth transition for fine grinding & pre-polishing
Application:
Ideal for concrete, terrazzo, marble and engineered stone wet grinding and polishing
Features:
Premium copper bond matrix, high density diamond distribution
Designed for wet-only use, excellent cooling & low dust
Aggressive cutting power, outstanding scratch removal
Ultra-stable grinding performance, long service life
Smooth transition for fine grinding & pre-polishing
Application:
Ideal for concrete, terrazzo, marble and engineered stone wet grinding and polishing
| Item no. | Diameterx Thickness |
| HWD303 | 75x3mm |
| HWD304 | 100x3mm |
| Grit size: #30,#50,#100,#200,#400 | |